Mashiinka hagaajinta iska caabinta filimka khafiifka ah - J3335D
Sharaxaada & Hordhac
TS3335D-I Mashiinka jarista laser multifunctional multifunctional wuxuu ku habboon yahay hagaajinta wareegyada filimada khafiifka ah ee kala duwan, sida gyroscopes inertial, iska caabiyeyaasha saxda ah ee sare, ICs-yada, iyo saxnaanta laser-ka-goynta dareemayaasha-filim khafiifka ah.
Mashiinka jarista TS3335D-II taxanaha wafer-level laser trimming wuxuu ku habboon yahay jarista waferrada semiconductor iyo aaladaha kala duwan ee saxda ah ee MEMS.
Sawirada Alaabta
Tilmaamaha Qalabka
1:Wuxuu isticmaalaa laser ultraviolet garaaca wadnaha ugu sarreeya oo leh hirar dhererkiisu yahay 355nm si loo gooyo.
2:Joogta ah oo la kontarooli karo awoodda leysarka xasilloonida sare.
3:Wuxuu ku gaaraa xakamaynta booska saxda ah iyada oo loo marayo sawirka muuqaalka farsamada meelaynta tooska ah.
4:Qeexitaan qani ah oo ku saabsan jarista iyo goynta dariiqyada.
5:Wuxuu si toos ah ula xiriiri karaa aaladaha dibadda isagoo adeegsanaya isgaarsiinno kala duwan sida shabakad,
GPIB, iyo deked taxane ah oo si toos ah loo gooyo.
6:Waxay isticmaashaa miiska shaqada ee XY oo sax ah oo si toos ah u soo noqnoqonaysa jar jaritaanka qaybo badan oo shaqo ah.
7:Kordhinta cabbirka isku dhafan iyo xakamaynta ama nidaamka cabbiraadda la fidin karo ee dibadda ah.
8:Interfaces leh aalado otomaatig ah oo kala duwan iyada oo loo marayo set qani ah oo 10 interface ah.
Tilmaamaha
Habaynta | ||
Qaabka | TS3335D - I | TS3335D - II |
Dhererka Mawjada Laser | 355 nm | 355 nm |
Awoodda Laser Magaca ah | > 2 W | > 1 W |
Dhexroorka Beam | 10 - 15 μm | 4-5 μm |
Xawaaraha sawirka | 0 - 6000 mm/s, si joogto ah loo hagaajin karo | 0 - 6000 mm/s, si joogto ah loo hagaajin karo |
Safarka miiska XY | 200*300 mm | 200*300 mm |
Shaxda XY Ku soo celi saxnaanta meelaynta | ± 1 μm | ± 1 μm |