Umatshini oNcinciweyo woKuchasana neFilimu – J3335D
Inkcazo kunye nentshayelelo
Uluhlu lwe-TS3335D-I lwe-laser multifunctional trimming machine lulungele ukulungiswa kweesekethe ezahlukeneyo zeefilim ezincinci, ezifana ne-inertial gyroscopes, i-high-precision resistors, i-analog ICs, kunye nokuchaneka kwelaser yokucutha kwe-sensors-film-film.
I-TS3335D-II series wafer-level laser trimming machine ilungele ukuchetywa kwe-semiconductor wafers kunye nezixhobo ezahlukeneyo ze-MEMS ezichanekileyo.
Imifanekiso yeMveliso
Iimpawu zeZixhobo
1:Isebenzisa i-laser ye-ultraviolet ye-pulse ephezulu kunye ne-wavelength ye-355nm ukucheba.
2:Amandla e-laser aqhubekayo kwaye alawulekayo.
3:Iphumeza ulawulo oluchanekileyo ngetekhnoloji yokumisa umfanekiso wevidiyo.
4:Inkcazo ecebileyo yokunciphisa kunye neendlela zokusika.
5:Unokunxibelelana nezixhobo zangaphandle ngokuzenzekelayo ngeendlela ezahlukeneyo zonxibelelwano ezifana nenethiwekhi,
I-GPIB, kunye ne-serial port yokucheba oluzenzekelayo.
6:Isebenzisa i-XY echanekileyo ephezulu yokulungisa ukuphindaphinda okuzenzekelayo kwemisebenzi emininzi.
7:Umlinganiselo odityanisiweyo webhodi kunye nolawulo okanye inkqubo yomlinganiselo eyandisiweyo yangaphandle.
8:Ujongano kunye neeplatifti ezahlukeneyo ezizenzekelayo ngokusebenzisa isethi esityebileyo se-interface ezili-10.
Iinkcukacha
| Ulungelelwaniso | ||
| Umzekelo | TS3335D - I | TS3335D - II |
| Laser Wavelength | 355 nm | 355 nm |
| Amandla eLaser yeNominal | > 2W | > 1W |
| Ububanzi beBeam | 10 - 15 μm | 4 - 5 μm |
| Isantya sokuskena | 0 - 6000 mm / s, ngokuqhubekayo adjustable | 0 - 6000 mm / s, ngokuqhubekayo adjustable |
| XY Table Travel | 200*300 mm | 200*300 mm |
| Itheyibhile ye-XY Phinda ukuPositioning Ukuchaneka | ± 1 μm | ± 1 μm |
