Thin Film Resistance Adjustment Machine – J3335D
Description & Introduction
The TS3335D-I series multifunctional laser trimming machine is suitable for tuning of various thin-film circuits, such as inertial gyroscopes, high-precision resistors, analog ICs, and precision laser trimming of thin-film sensors.
The TS3335D-II series wafer-level laser trimming machine is suitable for trimming of semiconductor wafers and various high-precision MEMS devices.
Product Pictures
Equipment Features
1: Utilizes peak pulse ultraviolet laser with a wavelength of 355nm for trimming.
2: Continuous and controllable high-stability laser power.
3: Achieves precise position control through video image automatic positioning technology.
4: Rich definition of trimming and cutting trajectories.
5: Can communicate with external devices automatically through various communication interfaces such as network,
GPIB, and serial port for automatic trimming.
6: Utilizes high-precision X-Y worktable for stepwise repetitive automatic trimming of multiple workpieces.
7: Onboard integrated measurement and control or external expandable measurement system.
8: Interfaces with various automation platforms through a rich set of 10 interfaces.
Specifications
| Configurations | ||
| Model | TS3335D - I | TS3335D - II |
| Laser Wavelength | 355 nm | 355 nm |
| Nominal Laser Power | > 2 W | > 1 W |
| Beam Diameter | 10 - 15 μm | 4 - 5 μm |
| Scanning Speed | 0 - 6000 mm/s, continuously adjustable | 0 - 6000 mm/s, continuously adjustable |
| X-Y Table Travel | 200*300 mm | 200*300 mm |
| X-Y Table Repeat Positioning Accuracy | ± 1 μm | ± 1 μm |
